交流阻抗測定化學鍍鎳的電化學機理

An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements

摘要: 采用交流阻抗技術對化學鍍Ni-P合金的沉積過程進行原位測定,所獲得的Nyquist阻抗圖上出現感抗圈。綜合交流抗擊以及還原劑濃度影響研究結果,提出一個包括H₂PO₂^-離子表面吸附步驟的化學鍍鎳電化學機理。

Abstract: The Model 368 system was used to measure the AC impedance of the process of electroless nickel plating. One inductive loop is found at low frequencies. A theoretical model including the step of adsorption of H₂PO₂^- ions is established based on the AC impedance measurements.