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  • Ag-Cu、Ag-H62復合電接點材料界面的原子擴散行為

    Interface Atomic Diffusion of the Ag-Cu and Ag-H62 Electric Contact Materials

    • 摘要: 用掃描電鏡能譜分析半定量和定量測定,經不同熱處理工藝的Ag-Cu、Ag-H62冷復合和磁控濺射復合電接點材料界面的成分分布,計算了擴散系數激活能實驗表明,材料復合界面是金屬鍵結合。

       

      Abstract: After the Ag-Cu and Ag-H62 electric contact materials arc made by cold press-rolling (or sputtering in magnetic field) and annealed, the quantitative and semi-quantitative analysis are carred out by scanning electron microscope. The results show that the interfaces are of metallic bonding. The diffusion coefficients and the activation energies are also calculated.

       

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