通過微孔鍍金改善晶體管外引線的耐蝕性
Improvement of Corrosion Resistance of Transistor Leads by Compositive Gold Plating
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摘要: 本文報導了用于耐蝕用途的微孔鍍金的工藝。晶體管外引線的腐蝕斷裂是長期未能解決的問題。通過在可伐引線上電鍍暗鎳——Ni-Al2O3復合鍍層——酸性脈沖鍍金,構成微孔金鍍層體系,使腐蝕斷裂傾向明顯降低。Abstract: This paper reports the new technology which improves the corrosion resistance of transtor leads by compositive gold plating. A plating system consisting of dark nickel, Ni-Al2O3 compositive plating and acidic pulse gold plating is plated on Kovar leads. The porous gold plating system decreases the tendency of corrosion fracture distinctly.
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